BGA Rework
We can accommodate large substrates and thick substrates.
BGA rework refers to the process of partially heating BGA on completed circuit boards to remove and install them. Our company has newly introduced a BGA rework device that can handle large circuit boards (Max 500×600) and thick boards (Max 7mm) due to its high thermal capacity, in addition to being lead-free. For reballing work when "wanting to reuse components," we have solder balls available in both eutectic and lead-free options, compatible with pitches ranging from 1.27mm to 0.4mm. We can also accommodate BGA jumper work.
- Company：ピーダブルビー 草津事業所
- Price：Other
